Due to the bonding parts in actual use will be affected by a variety of stress test, we'll have a different test in the laboratory to ensure the quality of the adhesive. Commonly used way is to test the production equipment production of RFID CARD. Chip positioning, we can through the visual system to detect the performance of the label can be read by the card system to test.
In addition to these production equipment with quick test method, and a more detailed follow-up testing methods, used to test the bonding quality.
combo cardsshear force: using the shear force test machine tool chip off from the base material. Shear tests, adhesive, stick relay ideal value between chip and substrate should not less than 25 N/was.
The adhesive curing degree: can use analysis DSC (differential scanning calorimetry) to detect adhesive is fully cured within the selected parameters. This test method can reflect the due to the low temperature curing time is too short or appear abnormal situation.
Micrograph of the micrograph, chip and substrate can be pressed into the antenna shows chip and its convex point. Pressure deficiency can lead to poor rfid inlay, pressure is too big, will lead to a chip or base material damage.
Read distance: in this test, keep the card reader power does not change, will continue to far away from the card reader, for the label until the prompt card read error. Or, continue to increase card reader transmission power, until the start tag to send data; In this case, the distance between tag and reader has set in advance
RFID tags can be divided into passive, passive (also known as semi-active),initiative
Passive tags have no internal power supply. The internal integrated circuit to drive through the received electromagnetic waves, the electromagnetic wave is made by the RFID reader. When the label to receive enough strength of the signal, can send data to the reader. These data not only include the ID number (the only global label ID), can also include exists in the label data in a block in the EEPROM in advance.
Due to the passive tags with low price, small size, the advantages of without power supply. NFC CARD mainly passive in the market.
In general, the passive tag antenna has two tasks, the first: receive the electromagnetic wave emitted from the reader, in order to drive tcombo cards IC; The second: the tag echo signal, the need to make a switch on the impedance of the antenna, to generate the change of 0 s and 1 s. Rebound, the problem is, want to have the best efficiency, antenna impedance must be designed in the "open circuit and short circuit", which in turn will make the signal reflected completely, cannot be tag IC receiver, semi active tags in order to solve this problem. Instn is similar to the passive, but it is much more a small battery, power can drive the tag IC, the IC is in a state of work. Such benefits, the antenna can be receiving the task of electromagnetic wave, sufficient for the use of echo signal. Rather than passive, semi active has faster response speed, better efficiency.
And passive and half passive, active tags itself has internal power supply, internalcontactless cards to supply the power needed to produce the external signal. In general, active tags have longer reading distance and large memory capacity can be used to store some additional messages transmitted by the reader
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